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ICM 2023 IEEE International Conference on Microelectronics

IEEE · 30th edition · Sousse, Tunisia

The 30th International Conference on Microelectronics

Circuits, systems, design automation and micro/nano electronics come together in a programme of keynotes, tutorials, special sessions and peer reviewed papers.

Dates16 to 19 December 2023
VenueIberostar Kantaoui Bay, Sousse

Authors of selected papers were invited to resubmit extended versions for journal consideration.

IEEE Circuits and systems CAD tools and design Micro / nano electronics

01 / About

A thirty year record of microelectronics research

The International Conference on Microelectronics has moved across Southern Europe, Western Asia and Southern Asia for nearly three decades. Its 30th edition was hosted in Tunisia by the Computer and Embedded Systems Laboratory.

The International Conference on Microelectronics (ICM) has been held in numerous countries across Southern Europe and Western and Southern Asia for the past 29 years. The 30th edition was hosted by the Computer and Embedded Systems Laboratory (CES lab) in Tunisia.

ICM 2023 examined circuits and systems, CAD tools and design, and micro/nano electronics, together with special topics. The programme included oral and poster sessions and tutorials given by experts in state of the art topics. The regular technical programme ran for three days.

Authors submitted full papers through the ICM 2023 electronic submission portal. Each paper was evaluated by at least two reviewers, and accepted papers were prepared for the IEEE Xplore Digital Library.

01

Four page papers

Regular papers used the official IEEE paper template and were limited to four pages, including results, figures and references.

02

Two reviewer evaluation

Every submission was assessed by at least two reviewers. Submissions carried sufficient detail to support critical review.

03

IEEE Xplore

Papers accepted for oral presentation were submitted for inclusion in the IEEE Xplore Digital Library.

02 / Call for papers

Topics that span the microelectronics stack

Authors were invited to upload full papers through the ICM 2023 electronic submission portal. Papers were solicited in, but not limited to, the topics below. Regular papers used the official IEEE paper template and did not exceed four pages, including results, figures and references.

Track 01

General circuits and systems

  • Analog and RF circuit design techniques
  • Digital signal and data processing
  • Wireless communication systems
  • Nonlinear circuits
  • System on Chip (SoCs)
  • VLSI for signal and image processing
  • Integrated antenna and front end co design
  • Signal processing in communications
Track 02

CAD tools and design

  • Simulation: process, device, circuit, logic, timing and functional
  • Layout: placement, routing, floor planning, symbolic, ERC and DRC
  • Silicon optimization
  • Parallel embedded systems
  • Testing and formal verification
  • CAD for FPGAs
  • High level synthesis tools
  • Design and testability
Track 03

Micro / nano electronics

  • Device characterization and modeling
  • Device physics and novel structures
  • Process technology, CMOS and BJT
  • BiCMOS and GaAs
  • Reliability and failure analysis
  • Optoelectronics
  • MEMS devices
  • Packaging and surface mount technology

Call for special session proposals

Proposals closed 20 August 2023

The ICM 2023 conference included special sessions on highly specialized topic areas within the scope of the conference and its themes. The organizing committee invited professionals to propose special sessions that complement the regular programme.

The topic of a special session proposal should be timely and compelling. Proposals were requested before 20 August 2023, by email in a single PDF file to the special sessions co chairs. Further details were included in the call for special session.

Call for tutorial proposals

Proposals closed 20 August 2023

The ICM 2023 organizing committee invited proposals and ideas for tutorials to be held as part of the conference. Topics needed sufficient relevance to the general scope of the conference.

Prospective tutorial speakers were invited to submit proposals before 20 August 2023, by email in a single PDF file to the tutorial co chairs.

Five accepted special sessions

Papers closed 10 October 2023

Five proposals for special sessions were accepted. Papers for each session were invited before 10 October 2023, by email to the session organizers.

01

Energy Efficient Cyber Physical Systems

Organizer: Dr. Davide Patti

Email Dr. Davide Patti

Paper deadline 10 October 2023

03 / Keynotes and tutorials

Three keynotes. Three tutorials.

The invited programme connected neural signal recording, wearable health care, flexible radios, cyber physical system design, machine learning for EDA and automotive digital twins.

Keynote 01

Neural Signal Recording Amplifiers

Dr. Yong Ping Xu · National University of Singapore

Wearable and implantable medical devices have shown great benefits in monitoring health conditions and combating various diseases that cannot be cured by conventional medical means. The physiological and neural signal acquisition is at the very front end of such devices, and its performance is critical to the overall system. This talk starts with a quick introduction to neural signal recording, followed by several neural recording amplifier designs in which different circuit techniques are employed to improve performance. The talk concludes with the recent trend in neural signal recording amplifier design.

Speaker profile

Dr. Yong Ping Xu received his PhD in Electrical Engineering from the University of New South Wales, Australia, in 1994. He was a Lecturer at the University of South Australia, Adelaide, from 1996 to 1998. He joined the Department of Electrical and Computer Engineering at the National University of Singapore (NUS) in 1998 and is now an Associate Professor. His research interests include integrated circuit design for MEMS, sensors and biomedical applications. Dr. Xu is a member of the Technical Program Committee of the 2017 Symposium on VLSI Circuits. He served on the TPC of the IEEE International Solid State Circuits Conference (ISSCC) from 2014 to 2023 and the TPC of the IEEE Asian Solid State Circuits Conference (A SSCC) from 2009 to 2013.

He was the Organizing Committee Chair for A SSCC 2013 in Singapore and has been a member of the A SSCC Steering Committee since 2014. Dr. Xu is a Distinguished Lecturer of the IEEE Solid State Circuits Society for 2017 and 2023.

Keynote 02

A Self Powered IoT SoC Platform for Wearable Health Care

Prof. Mohamed Ismail · Wayne State University

This talk focuses on IoT Systems on Chip (SoCs) as part of research work targeting applications in self powered chipsets for public health, ambient intelligence, safety and security, and IoT. One application discussed in detail is a groundbreaking self powered IoT SoC platform for wearable health care. It presents a fully integrated ECG signal processing system for the prediction of ventricular arrhythmia using a unique set of ECG features extracted from two consecutive cardiac cycles. Two databases of heart signal recordings from the American Heart Association (AHA) and MIT PhysioNet were used as training, test and validation sets to evaluate the performance of the proposed system. The system achieved an accuracy of 99 percent. The ECG signal is sensed using a flexible, dry, graphene based technology, and the system is powered by harvesting human thermal energy. The system architecture is implemented in GlobalFoundries 65 nm CMOS process, occupies 0.112 mm² and consumes 2.78 microwatt at an operating frequency of 10 kHz and from a supply voltage of 1.2 V. To our knowledge, this is the first SoC implementation of an ECG based processor capable of predicting ventricular arrhythmia hours before the onset and with an accuracy of 99 percent.

Speaker profile

Prof. Mohamed Ismail is a professor and Chair of Electrical and Computer Engineering at Wayne State University, Detroit, and a Fellow of IEEE. He is an adjunct professor with KUSTAR, Abu Dhabi, UAE. Prof. Ismail is a prolific author and entrepreneur in chip design, test and nanotechnology and has spent over 25 years in academia and industry in the US and Europe. He obtained his BS and MS from Cairo University, Egypt, and his PhD from the University of Manitoba, Canada, all in electrical engineering. He held a Research Chair on nano electronics circuits at the Swedish Royal Institute of Technology (KTH), where he founded the RaMSiS Research Group. He had visiting appointments in Finland (Aalto University), Norway (NTH and University of Oslo), the Netherlands (Twente University) and Japan (Tokyo Institute of Technology).

He is the founder of the Ohio State University (OSU) Analog VLSI Lab, one of the foremost research entities in analog, mixed signal and RF integrated circuits, and served as its Director. He joined KUSTAR, UAE, in 2011, where he held the ATIC (now Mubadala Technology) Professor Chair and is Founding Chair of the ECE Department. He is the Founding Director of the Khalifa Semiconductor Research Center (KSRC). His research focuses on CMOS RF and mm wave ICs, energy harvesting and power management, wearable biochips and systems on chip (SoCs) for the Internet of Things (IoT) and smart self driving vehicles. He joined Wayne State University in Detroit, Michigan, USA, as professor and Chair of ECE while maintaining his position at KUSTAR as an adjunct. He leads a research team that developed the first CMOS combo 802.11a/b/g wireless radio chip, which was commercialized. More recently, he and his colleagues developed the world's first self powered wearable device that predicts the onset of a heart attack long before it happens and is currently in the process of commercializing it in partnership with the Cleveland Clinic, a world leading hospital in cardiology. He advised the work of over 50 PhD students and over 100 MS students. He authored or coauthored over 20 books and over 170 journal publications, 300 conference papers and has 15 US patents granted and several pending.

Keynote 03

Flexible Radios and Flexible Networks

Dr. Alyssa Apsel · Cornell University

Over the past decades the world has become increasingly connected, with communications driving both markets and social movements. Low power electronics, efficient communications and better battery technology have all contributed to this revolution, but the cost and power required for these systems must be pushed further to make cheap, ubiquitous and seamless communication accessible to a wider community. This talk discusses two engineering approaches to this problem. It looks at various approaches to drive power down in radio networks that span circuits and systems. It also looks at creative biologically inspired approaches to enabling very low power networks and IoT. Finally, it discusses how adding flexibility and building reconfigurable hardware can likewise build lower power and less costly consumer systems that adapt across protocols and networks and work under changing device technologies.

Speaker profile

Dr. Alyssa Apsel received the BS from Swarthmore College in 1995 and the PhD from Johns Hopkins University, Baltimore, Maryland, in 2002. She joined Cornell University in 2002, where she is currently Director of Electrical and Computer Engineering. She was a Visiting Professor at Imperial College, London, from 2016 to 2023. The focus of her research is on power aware mixed signal circuits and design for highly scaled CMOS and modern electronic systems. Her current research is on the leading edge of ultra low power and flexible RF interfaces for IoT.

She has authored or coauthored over 100 refereed publications, including one book in related fields of RF mixed signal circuit design, ultra low power radio, interconnect design and planning, photonic integration and process invariant circuit design techniques, resulting in ten patents. She received best paper awards at ASYNC 2006 and IEEE SiRF 2012, had a MICRO Top Picks paper in 2006, received a college teaching award in 2007, received the National Science Foundation CAREER Award in 2004, and was selected by Technology Review Magazine as one of the Top Young Innovators in 2004. She is a Distinguished Lecturer of IEEE CAS for 2019 to 2023 and has served on the Board of Governors of IEEE CAS from 2014 to 2016 and as an Associate Editor of various journals, including IEEE Transactions on Circuits and Systems I and II, and Transactions on VLSI. She has also served as chair of the Analog and Signal Processing Technical Committee of ISCAS 2011, is on the Senior Editorial Board of JETCAS, as Deputy Editor in Chief of Circuits and Systems Magazine, and as the cofounder and Chair of ISCAS Late Breaking News. In 2016, Dr. Apsel cofounded AlphaWave IP Corporation, a multinational Silicon IP provider focused on multi standard analog Silicon IP solutions for IoT. As Chief Technology Officer of AlphaWave, Dr. Apsel led the company's global research capability with offices in Silicon Valley, Toronto and London.

Tutorial sessions

Three invited tutorials

The tutorial programme covered formal methods for cyber physical systems, machine learning for electronic design automation, and the verification of automotive digital twins.

Tutorial 01

Cyber Physical System Design Challenges

Prof. Tahar · Concordia University

Embedded systems are increasingly used in aerospace, next generation transportation, smart grids, smart cities, health care and cyber physical systems. The mix of heterogeneous technologies creates design and verification challenges, and these systems must meet strict safety, reliability, performance and security requirements. The tutorial introduces formal methods for modeling, analysis and verification, with real world case studies using photonic integrated circuits.

Full abstract

Due to major breakthroughs in software and engineering technologies, embedded systems are increasingly utilized in areas ranging from aerospace and next generation transportation systems, to smart grid and smart cities, to health care systems, and broadly speaking to what is known as Cyber Physical Systems (CPS). A CPS is primarily composed of several electronic, communication and controller modules and some actuators and sensors. The mix of heterogeneous underlying technologies poses a number of technical challenges to the design and, more severely, to the verification of such complex infrastructure. A CPS must adhere to strict safety, reliability, performance and security requirements, where one needs to capture both physical and random aspects of the various CPS modules and then analyze their interrelationship. Oftentimes, however, system bugs remain uncaught during the analysis and in turn cause unwanted scenarios that may have serious consequences in safety critical applications. This talk introduces some of the challenges surrounding the design and verification of contemporary CPS with the advent of smart technologies. In particular, it introduces recent developments in the use of formal methods for the modeling, analysis and verification of CPS and presents a few real world CPS case studies using physical components based on photonics integrated circuits.

Instructor profile

Prof. Tahar is Professor and Senior Research Chair in the Department of Electrical and Computer Engineering at Concordia University, Montreal, Quebec, Canada. He received his PhD in Computer Science with Distinction in 1994 from the University of Karlsruhe and his Diploma in Computer Engineering in 1990 from the University of Darmstadt, Germany. Prof. Tahar is founder and director of the Hardware Verification Group at Concordia University. He has made contributions and published over 400 papers in formal hardware verification, microprocessor and system on chip verification, analog and mixed signal circuits verification, VLSI design automation, and formal probabilistic, statistical and reliability analysis of systems.

Prof. Tahar has received several awards and distinctions, including Concordia University's Senior Research Award in 2007, earning him the title of University Fellow. In 2010, he was the recipient of a national Discovery Accelerator Award, given to the top 100 researchers in Canada in engineering and sciences. He is a member of the Order of Engineers of Quebec, a Senior Member of IEEE and a Senior Member of ACM.

Tutorial 02

Machine Learning for EDA

Dr. Eman El Mandouh · Mentor Graphics, Siemens Business

Machine learning and deep learning have become a new evolving addition to the field of design and design automation flows. This tutorial covers machine learning as well as deep learning algorithms and application methodologies that are necessary to build EDA applications and flows. It starts with classical machine learning methods, followed by an introduction to deep learning algorithms and the motivation behind why deep learning started taking off. It concludes by demonstrating how different ML and DL algorithms can be applied to practical EDA problems, namely in functional verification and physical verification.

Tutorial outline

The tutorial includes three major parts: Part 1, Introduction to Classical Machine Learning; Part 2, Introduction to Deep Learning; Part 3, Application to Common EDA Problems.

Instructor profile

Dr. Eman El Mandouh is Quality Director for the IC Verification and Validation Solutions Division at Mentor Graphics, Siemens Business. She has more than 18 years of experience in digital design and functional verification technology, including simulation based verification, advanced formal verification solutions, coverage driven verification, intelligent test generation, and FPGA prototype and debugging. She received her PhD in 2023 from Cairo University in Computer Engineering, where she also obtained her BSc and MSc. Her PhD thesis explored machine learning techniques in the functional verification field. She has published a number of articles in functional verification, machine learning, data mining and big data techniques with function verification and software testing.

As quality manager for EDA, Eman has been certified by world quality institutes, including Green Belt Six Sigma for Information Technology and Software Engineering from the European Software Institute (ESI) and Quality Manager and Organizational Excellence from the American Society for Quality.

Tutorial 03

Automotive Digital Twin: ADAS System Verification

Dr. Ashraf Salem · Mentor Graphics, Egypt

Automotive OEMs are taking more control of electronic control unit hardware and software architecture as ADAS and autonomous vehicles grow. The tutorial presents an integrated heterogeneous system of systems framework for simulating and verifying multiple ECUs, including a braking system use case with dashboard, engine, transmission and ADAS control units.

Full abstract

Automotive Original Equipment Manufacturers (OEMs) are taking more control of Electronic Control Unit (ECU) hardware and software architecture definition and exploration, mainly due to the rise of new technologies in ADAS and autonomous vehicles. The increasing number of cars with ECUs containing tens of processors, and the need to accelerate the simulation of thousands of driving scenarios and design parameters to ensure safety and reliability in autonomous driving, has expanded the use of hardware emulation in the loop based on its capacity and functional verification merits. This presentation introduces an integrated heterogeneous system of systems framework to simulate and verify multiple ECUs. The framework allows co development of the automotive system application software, operating system and controller hardware together with the mechanical system actuators, sensors, and the physical world environment and traffic scenarios all in one. A comprehensive manual and automatic braking system use case consisting of four ECUs at different levels of abstraction demonstrates the tools and interface technologies developed in house and integrated with third party tools. The first dashboard ECU acts as a CAN frame monitor and exerciser. The second engine control ECU is modeled as a virtual platform running an AUTOSAR software stack and engine control application. The third transmission controller ECU (digital subsystem) is modeled in Register Transfer Language (RTL) and a Bare Metal application on a RISC V running in a hardware emulator. The mechanical part of the braking system is modeled and exported as a Functional Mockup Unit (FMU) and connected to the hardware emulator using an FMI Transport Application (FMITAP) based on SystemC TLM 2.0 and FMI 2.0. The fourth ADAS Control ECU is modeled as a virtual platform running an automated emergency braking system application. This platform is wrapped as an FMU and imported together with sensor and ADAS scenarios. The effect of a crossing traffic scenario can be simulated, tracked and analyzed in all ADAS control loop elements.

Instructor profile

Dr. Ashraf Salem is Engineering Director at Mentor Graphics Egypt. He manages a group of 200 engineers working on the development of emulation, simulation, embedded systems and automotive products. Dr. Salem obtained his PhD from Grenoble University, France, in 1992. He received his BSc and MSc in Computer Engineering from Ain Shams University in 1983 and 1987, respectively. He was the CEO of the Technology Innovation and Entrepreneurship Center (TIEC) and professor of Computer Engineering at the Faculty of Engineering, Ain Shams University. Dr. Salem participated in the establishment of the ANACAD branch in Egypt in 1995, which was later acquired by Mentor Graphics and became one of the largest multinational development centers.

Dr. Salem participated in the establishment of the Software Engineering Competence Center and the Information Technology Institute in Egypt. He has published more than 120 scientific articles in computer aided design of digital circuits. He chaired technical committees at a number of international conferences and supervised more than 20 PhD and MSc theses in digital design and embedded systems. He also participated in a number of international research projects and developed one of the pioneer research products for formal verification in the 1980s.

04 / Programme

Read the ICM 2023 programme

Detailed information about the sessions of the ICM 2023 conference is available in the programme. The document is retained as the conference record.

Conference record

ICM 2023 programme

Session information, the technical programme and the invited events in one PDF document.

Download PDF

The programme is a PDF file of approximately 140 KB and downloads to your device.

Keynotes03
Tutorials03
Special sessions05
Oral and poster sessionsIncluded
Regular technical programme3 days

05 / Important dates

The 2023 calendar

Original deadlines are shown alongside the extended dates announced for the 30th edition. Special session papers and proposal dates are listed in the call for papers.

Full paper submission
OriginalJuly 15, 2023
Final dateAugust 20, 2023Extended
Notification of acceptance
OriginalSeptember 16, 2023
Final dateOctober 7, 2023Extended
Camera ready submission
OriginalOctober 11, 2023
Final dateOctober 21, 2023Extended

Special session proposals and tutorial proposals closed on 20 August 2023. Special session papers closed on 10 October 2023. Review the call for papers.

06 / Submission

From full paper to IEEE Xplore

Research papers were invited for the conference and could not exceed four pages using the IEEE standard template without page numbers. Full papers were submitted in PDF format through the online submission system.

Papers accepted for oral presentation were submitted for inclusion in the IEEE Xplore Digital Library.

IEEE reserves the right to exclude a paper from distribution after the conference, including the IEEE Xplore Digital Library, if the paper was not presented by the author at the conference.

Presentation requirement IEEE reserves the right to exclude a paper from distribution after the conference, including IEEE Xplore, if the paper is not presented by the author at the conference.

Instructions for camera ready preparation

Camera ready guidance was provided in a separate instructions file. To request a replacement copy, contact the publication chairs through the conference secretariat.

Request camera ready guidance

Publication support

Questions about the proceedings, paper identifiers or IEEE Xplore submission can be directed to the publication co chairs listed in the organizing committee.

Copyright submission

Complete the article details below to continue to the IEEE eCopyright service. Fields marked with an asterisk are required.

Separate multiple addresses with commas.

07 / Registration

Registration and presentation

All ICM 2023 conference authors registered and paid the applicable fee for a paper to be published in the conference proceedings. Registration also covered presentation guidance and access to the programme.

Registration rules

  • Every paper was registered at the regular rate to be published.
  • One registration covered a maximum of two papers.
  • Paper registration was considered complete once all fees had been paid.
  • Accepted but not presented manuscripts were not included in the conference proceedings.
  • Additional fees applied in the case of late registration.

Registration forms and the fee schedule were issued by the conference secretariat. Contact the registration desk for a copy of the forms and the current record.

Contact the registration desk

Early registrationNovember 10, 2023
Late registrationDecember 4, 2023

Presentation slides and posters

Presenter kits covered the preparation of presentation slides. Poster recommendations and a poster template were provided for authors.

Contact the publication co chairs for replacement copies of the presenter kit, poster recommendations or the poster template.

Request presentation guidance

08 / Committee

The people behind ICM 2023

An organizing committee drawn from universities, research laboratories and industry across Tunisia, Europe, the Middle East and North America.

Honorary co chairs

  • Lotfi KamounENIS, Tunisia
  • Mohamed ElmasryUniversity of Waterloo, Canada

General co chairs

  • Mohamed AbidENIS, Tunisia
  • Mohamad SawanPolytechnique Montreal, Canada

Technical programme co chairs

  • Mourad LoulouENIS, Tunisia
  • Ahmed MadianNile University, Egypt

Special sessions co chairs

  • Hassen MnifENETCom, Tunisia
  • Eric KerherveIMS, France
  • Naim Ben HamidaCIENA, Canada

Tutorials co chairs

  • Mohamed AtriFSM, Tunisia
  • Mohammad BakerKhalifa University, UAE
  • A. Al MaashariSultan Qaboos University, Oman

Panels co chairs

  • Mohammed IsmailWayne State University, USA
  • Amine BermakHamad Bin Khalifa University, Qatar
  • Noureddine BoulejfenCRMN, Tunisia

Plenary talk co chairs

  • Magdy BayoumiUniversity of Louisiana at Lafayette, USA
  • Brahim MezghaniENIS, Tunisia
  • Fabrice MonteiroUniversity of Lorraine, France

Industry liaison co chairs

  • Mohamad TabaaEMSI, Morocco
  • Achraf SalemMentor Graphics, Egypt
  • Zied MarrakchiMentor Graphics, Tunisia

Publicity co chairs

  • Piero MalcovatiUniversity of Pavia, Italy
  • Abderrazak JemaiINSAT, Tunisia
  • Mohammed Ben SalahKACST, Saudi Arabia

Publication co chairs

  • Abdallah KassemNDU, Lebanon
  • Mouna BakloutiENIS, Tunisia
  • Mounir SametENIS, Tunisia

Finance co chairs

  • Kais LoukilESCS, Tunisia
  • Tarek OuniENETCom, Tunisia

Local arrangement members

  • Wassim JmalChair, ISSATG, Tunisia
  • Agnes GhorbelENIS, Tunisia
  • Amina MagdichPNU, Riyadh, Saudi Arabia
  • Dorra MallouliENIS, Tunisia
  • Imen GhorbelENIS, Tunisia
  • Manel EuchiENIS, Tunisia
  • Rahma AloulouCRNS, Tunisia
  • Tarek FrikhaENIS, Tunisia
  • Yassin AydiENIS, Tunisia

International coordinators

  • Falah AwwadUAEU, UAE
  • Fouad El HajHassanLebanese University, Lebanon
  • Khaled SalamaKAUST, Saudi Arabia
  • Mohamed MasmoudiENIS, Tunisia
  • Said BelkoucheUCA, Morocco
  • Mountassar MaamounUniversity of Blida, Algeria
  • Abbes AmiraQatar University, Qatar
  • AbdoulRjoubJUST, Jordan
  • Ahmed AmmariOman
  • Mohab AnisAUC, Egypt
  • Abbas DandacheUniversity of Lorraine, France

09 / Sponsors

Host and supporting institutions

The 2023 edition was organized by the Computer and Embedded Systems Laboratory (CES lab). The conference acknowledged the following institutions in its sponsor and partner listings.

Host Computer and Embedded Systems Laboratory (CES lab)
InstitutionIEEE
InstitutionIEEE Test Technology Technical Council
InstitutionENIS, University of Sfax
InstitutionUniversity of Sfax
InstitutionPolytechnique Montreal
InstitutionUniversity of Waterloo
InstitutionKACST
InstitutionInstitut Français
InstitutionCRNS
InstitutionSofia Holding
InstitutionATRS
InstitutionIIT
InstitutionENETCom

Sponsorship and partnership enquiries can be sent to the conference secretariat.

Email the secretariat

10 / Travel and accommodation

Sousse, on the Gulf of Hammamet

ICM 2023 was held at the Iberostar Kantaoui Bay in Sousse, Tunisia. The venue sits 3 km from Port El Kantaoui and a short drive from Monastir airport.

Conference venue

Iberostar Kantaoui Bay

A 5 star hotel in Sousse, 3 km from Port El Kantaoui and a short drive from Monastir airport.

35.83 N 10.64 E

Accommodation

The conference was held at the Iberostar Kantaoui Bay. Contact the conference secretariat for hotel coordination.

Airport

Monastir Habib Bourguiba International Airport (MIR) is the closest airport to Sousse. Contact the conference secretariat for guidance on transfers.

Shuttle service

A shuttle service was available for foreign participants. Contact the secretariat to request shuttle assistance.

Visa information

For visa questions and invitation letters, contact the conference secretariat before making travel arrangements.

11 / Contact

Talk to the conference secretariat

For registration, submission, travel and sponsorship questions, contact the secretariat. Use the form or the direct email link.

Conference address

CES laboratory

ENIS, Sfax

Tunisia

  • Registration: forms, fees and presentation guidance
  • Submission: camera ready files and proceedings
  • Travel: shuttle service and visa questions
  • Sponsorship: partnership and institutional enquiries

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